Parker Chomerics launches EMI-shielded vent panels

Parker Chomerics is presenting EMI-shielded air-vent panels for data centre and electronics enclosure applications, combining electromagnetic interference shielding with airflow of up to 96%.

The stainless steel honeycomb panels are designed for electronic enclosures where heat management and EMI protection must be addressed at the same time. They are aimed at data centres and other increasingly power-dense electronic systems.

Enclosure manufacturers face a trade-off between allowing enough air to cool equipment and limiting electromagnetic interference that can affect sensitive electronics. The vent panels are intended to meet both requirements in a single product.

Alongside airflow and shielding, the panels offer noise attenuation, corrosion resistance and flame resistance. Bespoke versions are available in a range of dimensions, shapes, materials, frames, gaskets and plating options.

Production process

Parker Chomerics uses automatic optical inspection for real-time defect detection and automated laser welding for repeatable joining with limited thermal distortion. The company says this supports structural integrity and consistent EMI performance.

According to Parker Chomerics, data-driven quality control is used throughout production. Statistical process control and traceability form part of its manufacturing system, with process capability maintained at Cp and Cpk values above 1.67.

The company also says it can provide prototypes of the stainless steel air-vent panels within one week, with production lead times of two to four weeks. That timeline is intended to support customers moving from development to volume manufacturing.

A brief product statement accompanied the launch. "Parker Chomerics helps customers solve the combined challenges of EMI protection and thermal management without compromising airflow, quality or production speed," said Keith McDonald, International director of sales, Parker Hannifin.

McDonald added: "Our stainless steel honeycomb air-vent panels provide a highly engineered, customisable solution that supports reliable enclosure performance while helping customers move efficiently from prototype to full production."

Other materials

Parker Chomerics also outlined two thermal interface materials alongside the vent panels. One is THERM-A-GAP PAD 120LOE, which delivers thermal conductivity of 12.0 W/m-K with low silicone oil bleed and migration.

The second is THERM-A-GAP PAD 30RB, a 3.0 W/m-K thermally conductive gap-filler pad. The material is designed for rebound and reusability, allowing repeated compression and reapplication with limited loss of thickness.

According to the company, these materials are intended for applications including automotive electronics, telecommunications equipment, computing and consumer electronics.

The latest product focus reflects wider demand in electronics for components that support tighter enclosure designs and higher thermal loads, particularly in data centre equipment. The vent panels are intended to meet those conditions while maintaining shielding performance.