Siemens releases next-gen electronic systems design tools

Siemens Digital Industries Software has announced the release of its next-generation electronic systems design software.

The new iteration focuses on simplifying complex PCB design processes through a modern AI-enhanced user experience, aimed at shortening learning curves and accelerating time-to-productivity. The software unified Xpedition, Hyperlynx, and PADS Professional tools with cloud connectivity, enhancing collaboration and ease-of-use for users.

This release aligns with Siemens' strategy to address challenges faced by the electronic systems design industry, such as engineering talent shortages, supply chain uncertainties, and the increasing complexity of designs. In this context, Siemens has integrated AI to enhance engineers' capabilities, streamline workflows, and optimize designing processes.

AJ Incorvaia, Senior Vice President of Electronic Board Systems at Siemens Digital Industries Software, expressed enthusiasm about the release: "We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today's electronics engineers and the wider engineering community. This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head-on."

A key feature in the latest HyperLynx software is its modern user experience which is shared across all related Siemens products, enhancing productivity and making HyperLynx analysis more accessible to a broader group of designers.

Siemens' next-generation toolset also aims to mitigate talent shortages by providing predictive engineering capabilities and new AI-driven support assistance to enable engineers to adapt quickly with minimal learning requirements.

Cloud connectivity is a significant aspect, designed to facilitate collaboration across the value chain and offer access to specialized services, which aids in adapting to changing requirements and improves cooperation among stakeholders.

The integration of Siemens' Teamcenter and NX Software into this release further bridges ECAD and MCAD domains, enhancing collaboration and offering multi-BOM support. Compliance with rigorous security protocols and partnerships with cloud providers ensures data protection.

Tom Pitchforth, Vice President of Electronics Engineering at Leonardo, commended the development, "We are delighted to have collaborated with Siemens, providing feedback as an active user as they have developed this next-generation toolset. Siemens has been a critical partner for us for over 20 years, and it is essential that our toolset providers align with our future needs, particularly in a rapidly changing and complex landscape. Our primary goals in leveraging the new toolset capabilities include strategic objectives, such as enabling organizational flexibility, and tactical objectives, such as achieving rapid time-to-productivity."

Siemens' next-generation design solution includes design and verification requirements management, supporting model-based systems engineering. The first offerings, including Xpedition NG and HyperLynx NG, are now available with PADS Pro NG to follow in mid-2025.